Mégsem tetszik a termék? Semmi gond! A termékeket akár 30 napig visszaküldheti
Ajándékutalvánnyal nem hibázhat. A megajándékozott az ajándékutalványért bármit választhat kínálatunkból.
Akár 30 napos visszaküldési lehetőség
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
Szia! Libroamiko vagyok, a könyvtanácsadód.
Miben segíthetek?