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Wafer Level 3-D ICs Process Technology

Name: Wafer Level 3-D ICs Process Technology
Brand: Springer-Verlag New York Inc.
SKU: 01423024
Price: 65507 HUF
Availability: InStock
Author: Chuan Seng Tan
ISBN: 9781441945624

Chuan Seng Tan

Ronald J. Gutmann

L. Rafael Reif

Language

English

Book Paperback

Libristo code: 01423024

Publishers Springer-Verlag New York Inc., October 2010

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The c... Full description

Libristo code: 01423024

437 b

65 507 Ft

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This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.