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Solder Joint Technology

Name: Solder Joint Technology
Brand: Springer-Verlag New York Inc.
SKU: 01382091
Price: 94862 HUF
Availability: InStock
Author: King-Ning Tu
ISBN: 9780387388908

Materials, Properties, and Reliability

King-Ning Tu

Language

English

Book Hardback

Libristo code: 01382091

Publishers Springer-Verlag New York Inc., August 2007

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to... Full description

Libristo code: 01382091

639 b

94 862 Ft

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Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

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About the book

Full name Solder Joint Technology

Author King-Ning Tu

Language

English

Binding Book - Hardback

Date of issue 2007

Number of pages 370

EAN 9780387388908

ISBN 0387388907

Libristo code 01382091

Publishers Springer-Verlag New York Inc.

Weight 1590

Dimensions 156 x 235 x 24

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