Free shipping on orders over 19,990 Ft via Packeta, Fox Post Box, and DPD Collection Point

Check order status

Become part of a community of book lovers from all over the world and get access to a whole bunch of benefits. Create an account for free

Free delivery for purchases over 19 990 Ft

DPD point 990 Ft DPD courier 1 190 Ft GLS point 1 190 Ft Hungarian Post 1 795 Ft Hungarian Post 1 690 Ft Hungarian Post 1 690 Ft FoxPost 1 190 Ft Packeta point 1 190 Ft GLS courier 1 690 Ft

Contact

How to shop

Help

My account

▸ Empty :-(

Free shipping on orders over 19,990 Ft via Packeta, Fox Post Box, and DPD Collection Point

RF and Microwave Microelectronics Packaging II

Name: RF and Microwave Microelectronics Packaging II
Brand: Springer International Publishing AG
SKU: 19737758
Price: 39102 HUF
Availability: InStock
Author: KEN KUANG
ISBN: 9783319847191

KEN KUANG

Language

English

Book Paperback

Libristo code: 19737758

Publishers Springer International Publishing AG, June 2018

This book presents the latest developments in packaging for high-frequency electronics. It is a comp... Full description

Libristo code: 19737758

259 b

39 102 Ft

In stock at our supplier Shipping in 10-18 days

Up to 30 days for returns

Customers also purchased

Toledo. Acuarelas de viaje RUIZ PADRON

Paperback

11 170 Ft

Ang Modernong Gabay sa Stock Market Investing para sa mga Tinedyer Alan John E-book

Adobe ePub DRM

2 461 Ft

Odměna za nevěru Klára Mandausová

Hardback

3 969 Ft

Das ABC der Musik Meinhard Saremba

Paperback

3 489 Ft

Die Hernia Mesenterico-Parietalis Dextra Eisler

Paperback

4 769 Ft

Judecatori - Aforisme Sorin Cerin

Paperback

4 421 Ft

Meditacoes em Genesis. Um Mergulho na Intimidade com Deus Adilson Geraldo Routh

Paperback

14 244 Ft

Troublemaker Avery Flynn

Paperback

4 421 Ft

Fuhrung lernen Stephanie Kaudela-Baum

Hardback

24 372 Ft

CUCINA ITALIANA Risotti Aldo Giannini

Paperback

2 898 Ft

Eksplozje Wiśniewski Janusz L.

Paperback

3 322 Ft

Geschenkpapier VT gold-rot be (Rolle 30 cm)

Toy

36 704 Ft

De mal en peor José Zamora Linares

Paperback

6 249 Ft

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to "RF and Microwave Microelectronics Packaging" (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.