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Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module

Ceramic research and development in Japan

Language EnglishEnglish
Book Hardback
Book Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module K. Otsuka
Libristo code: 01435032
Publishers Kluwer Academic Publishers Group, April 1993
This book is a translation of an important Japanese work on electronic ceramics and includes much ex... Full description
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This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with ceramic materials interested in an overview of recent Japanese research in this rapidly developing field.

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About the book

Full name Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module
Author K. Otsuka
Language English
Binding Book - Hardback
Date of issue 1993
Number of pages 242
EAN 9781851665792
ISBN 185166579X
Libristo code 01435032
Publishers Kluwer Academic Publishers Group
Weight 1200
Dimensions 178 x 254 x 19

Categories

Technology, Engineering, Agriculture > Industrial chemistry & manufacturing technologies > Industrial chemistry & chemical engineering > Ceramic & glass technology
Technology, Engineering, Agriculture > Electronics & communications engineering > Electronics engineering > Electronic devices & materials
Technology, Engineering, Agriculture > Mechanical engineering & materials > Materials science
Computing & Information Technology > Computer science > Computer architecture & logic design
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