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Modeling and Simulation for Microelectronic Packaging Assembly

Manufacturing, Reliability and Testing

Language EnglishEnglish
Book Hardback
Book Modeling and Simulation for Microelectronic Packaging Assembly Sheng Liu
Libristo code: 01388967
Publishers John Wiley & Sons Inc, October 2011
Teaches the skills needed to shorten the time for design, manufacturing, reliability, and testing of... Full description
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49 568 Ft
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Teaches the skills needed to shorten the time for design, manufacturing, reliability, and testing of microelectronic package assembly§Liu and Liu begin with an overview of mechanics and modeling, including modeling validation tools and an explanation of concurrent engineering. They then move on to modeling in microelectronic packaging and assembly, coving packaging and assembly for typical ICs, optoelectronics, MEMS, SIP/3D, and nano interconnects. The next section explains modeling methods for package reliability and test, followed my modern modeling and simulation methodologies.§Models and simulates numerous processes in manufacturing, reliability and testing for the first time§Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing§Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products.§Subroutines and color images available for download from the books Companion Site

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About the book

Full name Modeling and Simulation for Microelectronic Packaging Assembly
Author Sheng Liu, Yong Liu
Language English
Binding Book - Hardback
Date of issue 2011
Number of pages 592
EAN 9780470827802
ISBN 0470827807
Libristo code 01388967
Publishers John Wiley & Sons Inc
Weight 942
Dimensions 173 x 247 x 35

Categories

Technology, Engineering, Agriculture > Electronics & communications engineering > Electronics engineering > Electronics: circuits & components
Technology, Engineering, Agriculture > Mechanical engineering & materials > Production engineering
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