Contact
How to shop
Delivery
Shopping guide
Encapsulation Materials for Neural Interface Devices
English
185 b
Up to 30 days for returns
Customers also purchased
/
Board book
26 450
Ft
/
Paperback
6 285
Ft
/
Paperback
2 172
Ft
/
Paperback
20 489
Ft
Neural interface devices have been developed for §neuroscience and neuroprosthetics applications to §record and stimulate nerve signals. Chronic use of §these devices is prevented by their lack of long-§term stability, due to device failure or immune §system responses. §Conformal, hermetic, biocompatible, and electrically §insulating coating materials that sustain chronic §implantation and guarantee stable recording or §stimulation are needed. Even though a large §selection of materials has been proposed and tested §for this purpose, to date, no material §presented in scientific literature has been §thoroughly characterized and qualified as a long-§term hermetic encapsulation material for silicon-§based neural interface devices. §In this work, hydrogenated amorphous silicon carbide §(a-SiCx:H) and Parylene-C films were investigated as §the encapsulation materials. The deposition §parameters and corresponding film properties were §explored and correlated with the encapsulation §characteristics.
About the book
English
Give this book today
It's easy
1 Add to cart and choose Deliver as present at the checkout 2 We'll send you a voucher 3 The book will arrive at the recipient's addressYou might also be interested in
/
Paperback
2 936
Ft
/
Paperback
8 401
Ft
/
Paperback
15 816
Ft
