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Electronic Packaging for High Reliability, Low Cost Electronics

Language EnglishEnglish
Book Paperback
Book Electronic Packaging for High Reliability, Low Cost Electronics Rao R. Tummala
Libristo code: 01973862
Publishers Springer, December 2010
Integrated circuits are expected to increase their speed and power dramatically and rapidly. New pac... Full description
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Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.

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About the book

Full name Electronic Packaging for High Reliability, Low Cost Electronics
Language English
Binding Book - Paperback
Date of issue 2010
Number of pages 296
EAN 9789048150854
ISBN 904815085X
Libristo code 01973862
Publishers Springer
Weight 474
Dimensions 160 x 240 x 17
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