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Electrical Modeling and Design for 3D System Integration - 3D Integrated Circuits and Packaging Signal Integrity, Power Integrity and EMC

Language EnglishEnglish
Book Hardback
Book Electrical Modeling and Design for 3D System Integration - 3D Integrated Circuits and Packaging Signal Integrity, Power Integrity and EMC Er-Ping Li
Libristo code: 04884809
Publishers John Wiley & Sons Inc, April 2012
The first book to address electromagnetic modeling methodologies for analysis of the large complex e... Full description
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50 363 Ft
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The first book to address electromagnetic modeling methodologies for analysis of the large complex electronic structures, Efficient Electromagnetic Modeling for High Speed Electronics systematically reviews a series of fast and efficient electromagnetic modeling techniques. The book presents a number of special methods to solve the SI, PI, and EMI problems and provides an overview of the existing electromagnetic modeling methods used in electronic chips, package, and PCB. The text also addresses the limitations individuals in the real-world engineering community face for design engineers, researchers, postgraduates, postdoctoral researchers, university professors, and consultants.

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About the book

Full name Electrical Modeling and Design for 3D System Integration - 3D Integrated Circuits and Packaging Signal Integrity, Power Integrity and EMC
Author Er-Ping Li
Language English
Binding Book - Hardback
Date of issue 2012
Number of pages 384
EAN 9780470623466
ISBN 0470623462
Libristo code 04884809
Publishers John Wiley & Sons Inc
Weight 774
Dimensions 156 x 241 x 18

Categories

Mathematics & Science > Mathematics > Applied mathematics > Mathematical modelling
Technology, Engineering, Agriculture > Electronics & communications engineering > Electronics engineering > Electronics: circuits & components
Mathematics & Science > Physics > Electricity, electromagnetism & magnetism
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