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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Language
English
English
Book
Hardback
The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlyi...
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Libristo code: 32905881
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The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.
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About the book
Full name
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Author
SUHIR
Language
English
English
Binding
Book - Hardback
Date of issue
2021
Number of pages
382
EAN
9781138624733
ISBN
113862473X
Libristo code
32905881
Publishers
Taylor & Francis Ltd
Weight
754
Dimensions
241 x 167 x 31
