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3D IC Integration and Packaging

Language EnglishEnglish
Book Hardback
Book 3D IC Integration and Packaging John Lau
Libristo code: 09043704
Publishers McGraw-Hill Education - Europe, August 2015
A comprehensive guide to 3D IC integration and packaging methods, solutions, and real-world applicat...
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A comprehensive guide to 3D IC integration and packaging methods, solutions, and real-world applications

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About the book

Full name 3D IC Integration and Packaging
Author John Lau
Language English
Binding Book - Hardback
Date of issue 2015
Number of pages 480
EAN 9780071848060
ISBN 9780071848060
Libristo code 09043704
Weight 1028
Dimensions 196 x 245 x 28
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